under the demand of electronic products towards thinness, smallness, rapidity, high functionality and high frequency, the calorific value is getting higher and higher.with the development and use of microprocessors above 3GHz, the calorific value is more than 80W, which makes the heat dissipation of computers a difficult problem.among them, workers

at present, most of the radiating fins are made of aluminum and copper.although the thermal conductivity of copper material is better than that of aluminum, the copper material has a significant ratio, high hardness and melting point, high price and difficult mass production, so its market share is only 5%, but the heat dissipation rate of aluminum radiating fins cannot keep up with the increasing amount of heat, the main reason is as follows.

during the operation of electronic components or devices, heat will inevitably be generated.in order to eliminate heat, heat must be discharged to the surrounding environment through conduction, convection and radiation to reduce the operating temperature of electronic products to maintain the stability and reliability of system operation.electronic group the function is to homogenize heat, so that heat can be quickly conducted and diffused.the function of the fin part is to dissipate heat.the heat diffused through the bottom plate is transferred by the increase of surface area, and the heat is dissipated from the surface of the fin to the surrounding environment by air convection.when the surface area of the fin is larger, the heat dissipation effect is better. the more can make electronic components achieve the desired performance, the more energy-saving effect.

in order to achieve the above purpose, the computer casing itself is a radiator, and the fan-free industrial computer structure device of the aluminum fin heat dissipation casing comprises a heat conduction block, a plurality of heat conduction pipes,-a motherboard, and a heat dissipation casing, wherein the heat dissipation casing is made of aluminum material and is extruded

the function of the heat conduction block is to equalize heat, so that the heat energy generated by the electronic components is quickly conducted to the heat dissipation shell, and the fin part extending outward from the heat dissipation shell disperses the heat energy to the outside.

the advantages of this article are:the heat energy of each electronic component in the system can be more quickly and uniformly conducted to the aluminum fin heat dissipation shell, and then conducted to the outside of the system, replacing the traditional method of installing fans in the system, which can effectively reduce the working noise and save the system in light and small industrial computers.